SP225GN
特點
- 優(yōu)良的機械加工能力，可用于沖孔。
- 提高剛撓結合板的耐翹曲性能。
應用領域
適用于散熱板、模腔板和多層剛撓結合板的粘結材料。- 產品性能
- 產品證書
- 資料下載
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.25 | TMA | ℃ |
190 |
| 2.4.24.2 | DMA | 225 | ||
|
Peel Strength |
2.4.8 |
Copper Foil（1/3oz） |
N/mm |
0.7 |
|
2.4.8 |
Copper Foil（1/2oz） |
N/mm |
1.0 | |
| 2.4.9 | CVL |
N/mm |
1.0 | |
|
T300 |
2.4.24.1 | TMA | min | ＞30 |
| Td | 2.4.24.6 | TGA(5% wt. loss) | ℃ | 410 |
|
Thermal Stress |
- |
288℃, solder dip |
s |
>600 |
|
Water Absorption |
2.6.2.1 | E-1/105+D-24/23 | % | 0.26 |
| CTE (Z-axis) | 2.4.24 |
TMA (before Tg) |
ppm/℃ | 34 |
| TMA (After Tg) | ppm/℃ | 115 | ||
|
|
|
|
||
| Dielectric Constant (RC67%@1GHz) | 2.5.5.9 | C-24/23/50 | - | 4.21 |
|
Dissipation Factor(RC67%@1GHz) |
2.5.5.9 |
C-24/23/50 |
- | 0.015 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
Remarks:
Remarks: Specimen thickness: 0.8mm. Alltypical value listed above is for your reference only, please turn to Shengyi Technology Co., Ltd. for detailed information.
Explanations: C=Humidity conditioning;D=Immersion conditioning in distilled water; E=temperature conditioning.
All the typical value listed above is foryour reference only, please turn to Shengyi Technology Co., Ltd. for detailedinformation, and all rights from this data sheet are reserved by ShengyiTechnology Co., Ltd.