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EN/CN

Product

Synamic8GN

Characteristic

● Low Dk/Df (10GHz): 3.28/0.0019

●High Tg (DMA): 205℃

● Excellent thermal reliability

● Excellent anti-CAF performance

● Lower Z-axis CTE, offering superior PTH reliability

Application Area

Ultra-high speed network equipment

Server, switch, storage, routers

High performance computing

High frequency measuring instruments

Optical communication products

  • Product Performance
  • Product Certificate
  • Data Download
Items Method Condition Unit Typical Value
Tg 2.4.24.4 DMA 205
Td 2.4.24.6 5% wt. loss 430
T288
2.4.24.1 TMA min >120
T300 2.4.24.1
TMA min
>120
Thermal Stress
2.4.13.1
288℃, solder dip
- PASS
CTE (Z-axis) 2.4.24 Before Tg ppm/℃ 35
After Tg ppm/℃ 200
50-260℃ % 1.8
Dissipation Constant
2.5.5.9 (1GHz)
C-24/23/50
- 3.35
2.5.5.5 (10GHz)
C-24/23/50
- 3.28
SPDR (10GHz)
C-24/23/50
- 3.49
Dissipation Factor
2.5.5.9 (1GHz)
C-24/23/50
- 0.0008
2.5.5.5 (10GHz)
C-24/23/50
- 0.0019
SPDR (10GHz)
C-24/23/50
- 0.0021
Peel Strength (1Oz, RTF2/HVLP2) 2.4.8 288℃/10s N/mm [lb/in] 0.82/0.80 [4.7/4.6]
Water Absorption 2.6.2.1 E-1/105+D-24/23 % 0.10
Flammability
UL94
C-48/23/50
Rating
V-0

Remarks:

Remarks:
1. All the typical value is based on the 30mil (6*2116) thickness specimen, but not guarantee data.
2. All the typical value listed above is for your reference only, please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.